Invention Grant
- Patent Title: Effective rear hard bias for dual free layer read heads
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Application No.: US16915718Application Date: 2020-06-29
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Publication No.: US11087785B1Publication Date: 2021-08-10
- Inventor: Ming Mao , Daniele Mauri , Chen-Jung Chien , Guanxiong Li
- Applicant: Western Digital Technologies, Inc.
- Applicant Address: US CA San Jose
- Assignee: Western Digital Technologies, Inc.
- Current Assignee: Western Digital Technologies, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Patterson & Sheridan, LLP
- Agent Steven H. Versteeg
- Main IPC: G11B5/39
- IPC: G11B5/39 ; G11B5/858 ; G11B5/48 ; G11B5/60 ; G11B5/851

Abstract:
The present disclosure generally related to read heads having dual free layer (DFL) sensors. The read head has a sensor disposed between two shields. The sensor is a DFL sensor and has a surface at the media facing surface (MFS). Behind the DFL sensor, and away from the MFS, is a rear hard bias (RHB) structure. The RHB structure is disposed between the shields as well. In between the DFL sensor and the RHB structure is insulating material. The RHB is disposed on the insulating material. The RHB includes a RHB seed layer as well as a RHB bulk layer. The RHB seed layer has a thickness of between 26 Angstroms and 35 Angstroms. The RHB seed layer ensures the read head has a strong RHB magnetic field that can be uniformly applied.
Information query
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