Invention Grant
- Patent Title: Inductor and inductor module having the same
-
Application No.: US16155165Application Date: 2018-10-09
-
Publication No.: US11094448B2Publication Date: 2021-08-17
- Inventor: Sung Jun Lim , Yeong Min Jeong , Han Kim , Kyung Ho Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2018-0054719 20180514
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/28 ; H01F27/32 ; H01F27/02 ; H01F27/29

Abstract:
An inductor includes: a body in which a plurality of insulating layers on which a plurality of coil patterns are arranged are stacked; and first and second external electrodes disposed on an external surface of the body, wherein the plurality of coil patterns are connected to each other through a coil connection portion and form a coil having both ends connected to the first and second external electrodes through a coil withdrawal portion, and wherein the coil connection portion is configured as a material having a higher thermal expansion coefficient than that of the insulating layers.
Information query