The present application discloses a display panel having a plurality of wirings in the fan-out area respectively connected to a plurality of signal lines in the display area, each of the plurality of wirings in the fan-out area configured to transmit a signal to one of a plurality of subpixels through one of the plurality of signal lines in the display area; and a plurality of bonding pads respectively connected to the plurality of wirings, configured to bond the plurality of wirings with a driver integrated circuit. The plurality of wirings are grouped into a plurality of groups of wirings comprising a first group of a plurality of first wirings and a second group of a plurality of second wirings. The plurality of first wirings are made of a first conductive material. The plurality of second wirings are made of a second conductive material. The second conductive material has a resistivity greater than that of the first conductive material.