Invention Grant
- Patent Title: Electronic component
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Application No.: US16054269Application Date: 2018-08-03
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Publication No.: US11101065B2Publication Date: 2021-08-24
- Inventor: Ji Sook Yoon , Sang Ho Shin , Byung Kug Cho , Sung Jin Park , Jae Wook Lee
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2017-0122324 20170922
- Main IPC: H01F5/00
- IPC: H01F5/00 ; H01F27/29 ; H01F17/04 ; H01F17/00 ; H01F27/30 ; H01F27/28

Abstract:
An electronic component includes a body having an internal electrode disposed therein, and an external electrode disposed on the body and connected to the internal electrode, wherein in a cross section of the body cut in length and thickness directions, the external electrode includes a first electrode layer disposed below the body and a second electrode layer covering at least the first electrode layer and a side portion of the body, and the internal electrode is connected to the second electrode layer through the side portion of the body.
Public/Granted literature
- US20190096568A1 ELECTRONIC COMPONENT Public/Granted day:2019-03-28
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