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    Multilayer electronic component having conductive patterns and board having the same
    3.
    发明授权
    Multilayer electronic component having conductive patterns and board having the same 有权
    具有导电图案的多层电子部件和具有该图案的板

    公开(公告)号：US09412509B2

    公开(公告)日：2016-08-09

    申请号：US14504107

    申请日：2014-10-01

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jeong Hwan Im ,  So Young Jun ,  Hyun Ju Jung ,  Sung Jin Park ,  Young Jin Ha

    IPC: H01F27/28

    CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F27/292 ,  H01F2017/002 ,  H01F2027/2809

    Abstract: A multilayer electronic component may include: a multilayer body including a plurality of insulating layers; an internal coil part provided by electrically connecting respective conductive patterns disposed on the plurality of insulating layers to each other; and first and second external electrodes disposed on both end surfaces of the multilayer body, respectively. A perimeter of at least one conductive pattern disposed in peripheral regions of the multilayer body may be smaller than a perimeter of a conductive pattern disposed in a central region of the multilayer body.

    Abstract translation: 多层电子部件可以包括：多层体，包括多个绝缘层; 通过将布置在所述多个绝缘层上的各个导电图案彼此电连接而提供的内部线圈部分; 以及设置在多层体的两端面上的第一外部电极和第二外部电极。 设置在多层体的周边区域中的至少一个导电图案的周边可以小于布置在多层体的中心区域中的导电图案的周边。

    COIL COMPONENT
    4.
    发明申请
    COIL COMPONENT 有权

    公开(公告)号：US20230054091A1

    公开(公告)日：2023-02-23

    申请号：US17735375

    申请日：2022-05-03

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Hyung Ho Kim ,  Sung Jin Park ,  Jin Hwan Kim

    IPC: H01F27/29 ,  H01F17/04 ,  H01F27/02

    Abstract: A coil component includes: a body including a molded portion having one surface and the other surface opposing each other, and a cover portion disposed on the one surface of the molded portion; a wound coil disposed between the molded portion and the cover portion in the body, and having first and second lead-out portions extending to one surface of the body; a first recess portion disposed in the one surface of the body; a first external electrode disposed on the one surface of the body to be connected to the first lead-out portion, and disposed along a surface of the first recess portion to have a first groove disposed therein; and a second external electrode disposed on the one surface of the body and connected to the second lead-out portion.

    Filter chip element and method of preparing the same
    7.
    发明授权
    Filter chip element and method of preparing the same 有权
    滤芯片及其制备方法

    公开(公告)号：US09397631B2

    公开(公告)日：2016-07-19

    申请号：US14078317

    申请日：2013-11-12

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yong Suk Kim ,  Sung Kwon Wi ,  Hyeog Soo Shin ,  Sang Moon Lee ,  Young Seuck Yoo ,  Sung Jin Park

    IPC: H03H7/01 ,  H03H1/00 ,  H01F17/00

    CPC classification number: H03H7/0138 ,  H01F17/0013 ,  H01F2017/0066 ,  H01F2017/0093 ,  H03H1/0007

    Abstract: Disclosed herein is a filter chip element including a ferrite substrate, internal coil patterns formed on the ferrite substrate; and a ferrite composite layer filled between the internal coil patterns formed on the ferrite substrate, wherein the ferrite composite layer includes foaming resin, thereby increasing magnetic permeability and a Q value which are important characteristics of a filter chip element for noise prevention among electromagnetic shielding components.

    Abstract translation: 本发明公开了一种过滤芯片元件，包括铁氧体衬底，形成在铁氧体衬底上的内部线圈图案; 以及填充在形成在铁氧体基板上的内部线圈图案之间的铁氧体复合层，其中，所述铁氧体复合层包括发泡树脂，从而提高作为电磁屏蔽部件中的噪声防止用过滤芯片元件的重要特性的磁导率和Q值 。

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