- 专利标题: Ceramic electronic component
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申请号: US16195181申请日: 2018-11-19
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公开(公告)号: US11101074B2公开(公告)日: 2021-08-24
- 发明人: Dong Hwi Shin , Dong Yeong Kim , Do Yeon Kim , Woo Chul Shin
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 代理机构: Morgan, Lewis & Bockius LLP
- 优先权: KR10-2018-0114260 20180921
- 主分类号: H01G4/232
- IPC分类号: H01G4/232 ; H01G4/30 ; H01G4/012 ; H01G4/248 ; H01G4/12
摘要:
A ceramic electronic component includes a body including dielectric layers and a plurality of internal electrodes and an external electrode including a connection portion and a band portion. The external electrode includes an electrode layer, a conductive resin layer, a nickel plating layer, and a tin plating layer. When an electrode layer thickness, a conductive resin layer thickness, a nickel plating layer thickness, a tin plating layer thickness of the band portion are defined as t3, t4, and t5, respectively, t5 is greater than or equal to 0.5 micrometer and less than 7 micrometer, and t5/(t3+t4) satisfies 1≤t5/(t3+t4)*100
公开/授权文献
- US20200098523A1 CERAMIC ELECTRONIC COMPONENT 公开/授权日:2020-03-26
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