Methods are disclosed for forming flat leads packages (e.g., QFP or SOT packages) having leads coated with a solder-enhancing material for improved solder mounting to a PCB or other structure. The method may include forming a flat leads package structure including an array of encapsulated IC structures formed on a common leadframe. An isolation cutting process may be performed to electrically isolate the IC structures from each other and define a plurality of leadframe leads extending from each IC structure. After the isolation cutting process, an immersion coating process is performed to coat exposed surfaces of the leadframe leads, including the full surface area of a distal end of each leadframe lead. The coating (e.g., tin coating) covering the distal ends of the leadframe leads may enhance the flow of solder material, e.g., when soldering to a PCB, to provide an improved solder connection.