Invention Grant
- Patent Title: Method of manufacturing a semiconductor device and a semiconductor device
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Application No.: US16590220Application Date: 2019-10-01
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Publication No.: US11101360B2Publication Date: 2021-08-24
- Inventor: Cheng-Yi Peng , Wen-Hsing Hsieh , Wen-Yuan Chen , Jon-Hsu Ho , Song-Bor Lee , Bor-Zen Tien
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/78 ; H01L29/16 ; H01L21/02 ; H01L29/08 ; H01L29/786 ; H01L29/24

Abstract:
A semiconductor device includes a channel region, a source/drain region adjacent to the channel region, and a source/drain epitaxial layer. The source/drain epitaxial layer includes a first epitaxial layer epitaxially formed on the source/drain region, a second epitaxial layer epitaxially formed on the first epitaxial layer and a third epitaxial layer epitaxially formed on the second epitaxial layer. The first epitaxial layer includes at least one selected from the group consisting of a SiAs layer, a SiC layer and a SiCP layer.
Public/Granted literature
- US20200168716A1 METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND A SEMICONDUCTOR DEVICE Public/Granted day:2020-05-28
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