Invention Grant
- Patent Title: Attachment mechanism for eartips
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Application No.: US16584905Application Date: 2019-09-26
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Publication No.: US11102563B2Publication Date: 2021-08-24
- Inventor: Craig M. Stanley , Sean T. McIntosh , Ethan L. Huwe , Brian R. Twehues , Mohammad Soroush Ghahri Sarabi
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Agency: Kilpatrick Townsend & Stockton LLP
- Main IPC: H04R1/10
- IPC: H04R1/10 ; E05F1/12 ; E05F3/20 ; H01F7/02 ; H05K5/00 ; H05K5/02 ; H05K5/03 ; H04R1/02 ; H04B1/38 ; H04B1/3827 ; G01V3/08 ; A45C11/00 ; A45C13/00

Abstract:
Embodiments describe an attachment mechanism including a wire bent in various directions forming a spring compressible in lateral directions. The wire includes a first wireform feature and a second wireform feature extending from the first wireform feature, where the first wireform feature and the second wireform feature each include: an intermediate segment; a u-shaped segment extending from the intermediate segment; and an end segment extending from the u-shaped segment.
Information query