Invention Grant
- Patent Title: Processing apparatus and cover member
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Application No.: US15787916Application Date: 2017-10-19
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Publication No.: US11104991B2Publication Date: 2021-08-31
- Inventor: Takashi Kamio , Toshiaki Fujisato
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2016-208129 20161024
- Main IPC: C23C16/44
- IPC: C23C16/44 ; C23C16/455 ; C23C16/52 ; C23C16/34

Abstract:
There is provided a processing apparatus including a stage disposed inside a chamber, and a cover member provided in an outer edge portion of the stage and configured to partition an interior of the chamber into a processing space above the stage and a bottom space below the stage. The cover member includes a first protrusion portion configured to make surface-to-surface contact with a surface of the stage, a second protrusion portion spaced apart from the first protrusion portion and configured to make surface-to-surface contact with the surface of the stage, and an exhaust path provided between the first protrusion portion and the second protrusion portion and configured to exhaust a gas from a buffer space formed by the cover member and the stage.
Public/Granted literature
- US20180112309A1 Processing Apparatus and Cover Member Public/Granted day:2018-04-26
Information query
IPC分类: