Invention Grant
- Patent Title: Method for manufacturing an encapsulation cover for an electronic package and electronic package comprising a cover
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Application No.: US16394925Application Date: 2019-04-25
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Publication No.: US11114312B2Publication Date: 2021-09-07
- Inventor: Benoit Besancon , Alexandre Mas , Karine Saxod
- Applicant: STMicroelectronics (Grenoble 2) SAS
- Applicant Address: FR Grenoble
- Assignee: STMicroelectronics (Grenoble 2) SAS
- Current Assignee: STMicroelectronics (Grenoble 2) SAS
- Current Assignee Address: FR Grenoble
- Agency: Crowe & Dunlevy
- Priority: FR1750048 20170103
- Main IPC: H01L21/56
- IPC: H01L21/56 ; H01L23/31 ; H01L23/552 ; H01L23/053 ; H01L23/06 ; H01L23/10 ; H01L23/24 ; H01L23/42 ; H01L23/433 ; H01L21/52 ; H01L23/04 ; H01L21/48
Abstract:
A method for manufacturing a cover for an electronic package includes placing an insert having opposite faces between opposite faces of a cavity of a mold. A coating material is injected in the mold cavity around the insert. The coating material is then set to form a substrate that is overmolded around the insert and produce the cover.
Public/Granted literature
Information query
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