Invention Grant
- Patent Title: Semiconductor device including contacts having different heights and different widths
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Application No.: US16662258Application Date: 2019-10-24
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Publication No.: US11114533B2Publication Date: 2021-09-07
- Inventor: Byungeun Yun , Jun-Gu Kang , Dong-Il Park , Yongsang Jeong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2019-0031256 20190319
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L23/535 ; H01L29/423 ; H01L27/088 ; H01L27/12 ; H01L23/528 ; H01L23/522

Abstract:
A semiconductor device includes: a substrate including a first region and a second region; a first gate stack on the first region of the substrate; a first source/drain contact at a first side of the first gate stack, wherein the first source/drain contact is connected to the substrate; a second gate stack on the second region of the substrate; and a second source/drain contact at a first side of the second gate stack, wherein the second source/drain contact is connected to the substrate, wherein a height of the second source/drain contact is greater than a height of the first source/drain contact, and wherein a width of the second source/drain contact is greater than a width of the first source/drain contact.
Public/Granted literature
- US20200303508A1 SEMICONDUCTOR DEVICE Public/Granted day:2020-09-24
Information query
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