- Patent Title: Semiconductor device packages and methods of manufacturing the same
-
Application No.: US16529572Application Date: 2019-08-01
-
Publication No.: US11120988B2Publication Date: 2021-09-14
- Inventor: Pei-Jen Lo , Cheng-Lung She
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaohsiung
- Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee: Advanced Semiconductor Engineering, Inc.
- Current Assignee Address: TW Kaohsiung
- Agency: Foley & Lardner LLP
- Main IPC: H01L23/58
- IPC: H01L23/58 ; H01L21/02
Abstract:
A semiconductor device package includes a first semiconductor device, a first redistribution layer (RDL) structure and a second RDL structure. The first semiconductor device has a first conductive terminal and a second conductive terminal. The first RDL structure covers the first conductive terminal. The second RDL structure covers the second conductive terminal and being separated from the first RDL structure.
Public/Granted literature
- US20210035794A1 SEMICONDUCTOR DEVICE PACKAGES AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2021-02-04
Information query
IPC分类:
