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公开(公告)号：US11120988B2
公开(公告)日：2021-09-14
申请号：US16529572
申请日：2019-08-01
Applicant: Advanced Semiconductor Engineering, Inc.
Inventor： Pei-Jen Lo , Cheng-Lung She
Abstract: A semiconductor device package includes a first semiconductor device, a first redistribution layer (RDL) structure and a second RDL structure. The first semiconductor device has a first conductive terminal and a second conductive terminal. The first RDL structure covers the first conductive terminal. The second RDL structure covers the second conductive terminal and being separated from the first RDL structure.
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