Invention Grant
- Patent Title: Plasma processing apparatus
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Application No.: US15941853Application Date: 2018-03-30
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Publication No.: US11127574B2Publication Date: 2021-09-21
- Inventor: Yoshio Kawamata , Yu Kambe
- Applicant: SHIBAURA MECHATRONICS CORPORATION
- Applicant Address: JP Yokohama
- Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee Address: JP Yokohama
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer
- Priority: JPJP2017-073050 20170331
- Main IPC: H01J37/34
- IPC: H01J37/34 ; H01J37/32 ; C23C14/50 ; C23C14/56

Abstract:
A plasma processing apparatus includes a conveyance unit that has a rotator in a vacuum container, and circulating carries a workpiece by the rotator along a circular conveyance path, a cylindrical member extended in a direction toward the conveyance path in the vacuum container, a window member that divides a gas space where a process gas is introduced and an exterior, and an antenna causing the process gas to generate inductive coupling plasma for plasma processing when power is applied. The cylindrical member is provided with an opposing part with the opening and faces the rotator, a dividing wall is provided between the opposing part and the rotator so as not to contact the opposing part and the rotator and not to move relative to the vacuum container, and the dividing wall is provided with an adjustment opening that faces the opening, and adjusts a range of the plasma processing.
Public/Granted literature
- US20180286645A1 PLASMA PROCESSING APPARATUS Public/Granted day:2018-10-04
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