SUBSTRATE CLEANING APPARATUS AND SUBSTRATE CLEANING METHOD

    公开(公告)号:US20250091095A1

    公开(公告)日:2025-03-20

    申请号:US18891253

    申请日:2024-09-20

    Abstract: According to one embodiment, a substrate cleaning apparatus includes: a cleaning liquid supply unit for supplying a cleaning liquid to a rotating substrate, a first cleaning head for cleaning at least one surface of the rotating substrate by bringing a brush into contact with the one surface of the substrate, a second cleaning head for cleaning the one surface of the substrate by bringing a brush into contact with the one surface of the substrate, a turning arm for turning the first cleaning head and the second cleaning head, and a controller. The controller controls the turning arm such that, during cleaning in which a brush of one of the first cleaning head and the second cleaning head is brought into contact with a surface of the substrate to perform cleaning, the brush of the other is positioned at a position outside the substrate.

    WAFER STORAGE CONTAINER DRYING APPARATUS AND CLEANING SYSTEM

    公开(公告)号:US20240302099A1

    公开(公告)日:2024-09-12

    申请号:US18583578

    申请日:2024-02-21

    CPC classification number: F26B25/003 B08B9/20 F26B3/02 B08B2209/08

    Abstract: According to one embodiment of the present disclosure, a wafer storage container drying apparatus includes a drying tank for drying a wafer storage container that has a storage space connected to an opening and configured to store a wafer, and includes a body including a flange gripped by a robot, and a door installed to be openable and closable with respect to the opening, wherein the drying tank includes a carrying-in/out port configured to be openable and closable by an opening and closing cover, a body receiver configured to receive the body of the wafer storage container in a state where the flange faces the carrying-in/out port; and a door holder configured to hold the door such that each side of the door is neither orthogonal nor parallel to one side that forms the carrying-in/out port, when the drying tank is viewed in a plan view.

    Substrate carrying apparatus
    4.
    发明授权

    公开(公告)号:US11996310B2

    公开(公告)日:2024-05-28

    申请号:US17476368

    申请日:2021-09-15

    Inventor: Masaaki Furuya

    Abstract: A substrate carrying apparatus that can reduce attachment of dust to substrates can be provided. The substrate carrying apparatus 1 of the present embodiment includes a carrying arm 2 for carrying a substrate, a column 32 standing up from a base body 31 with fixed angle, an upper link 33 which supports the carrying arm 2 at one end, which is rotatably connected to the column 32, and which moves the carrying arm 2 up and down in accordance with a rotation, a lower link 34 which is connected to be rotatable around an axis in parallel with a rotation axis of the upper link 33 as a center below a portion of the column 32 connected to the upper link 33, a connection link 35 which is rotatably connected to the upper link 33 and the lower link 34 so that the upper link 33 rotates in accordance with a rotation of the lower link 34, and a driving unit 4 which rotates the lower link 34.

    CLEANING APPARATUS FOR WAFER STORAGE CONTAINER

    公开(公告)号:US20240091828A1

    公开(公告)日:2024-03-21

    申请号:US18369002

    申请日:2023-09-15

    CPC classification number: B08B9/0813 B08B9/20 B08B9/46 B08B2209/08

    Abstract: According to an embodiment of the present disclosure, the cleaning apparatus includes a cleaning tank body having a body opening and a cleaning space; a lid provided to be openable and closable with respect to the body opening; a mounting stage provided in the cleaning space placing a shell of a wafer storage container; a first ejector that ejects a cleaning liquid into a storage space of the shell; a second ejector that ejects the cleaning liquid into an outer portion of the shell; a first discharge port that discharges the cleaning liquid ejected into the storage space of the shell; a second discharge port that discharges the cleaning liquid that has passed through the outer portion of the shell; and a particle counter that measures particles in the cleaning liquid discharged by the first discharge port.

    SUBSTRATE PROCESSING APPARATUS
    6.
    发明公开

    公开(公告)号:US20230271231A1

    公开(公告)日:2023-08-31

    申请号:US18114377

    申请日:2023-02-27

    CPC classification number: B08B7/0092 B08B7/0014

    Abstract: According to one embodiment, a substrate processing apparatus includes: a stage rotatable around a central axis; a plurality of holders provided on the stage to hold a substrate; a cooler capable of supplying a cooling gas to a space between the stage and the substrate; and a liquid supply capable of supplying a liquid to a surface of the substrate on an opposite side to the stage. When holding the substrate, each of the plurality of holders moves toward the central axis along a surface of the stage so as to surround a peripheral edge of the substrate and the space between the stage and the substrate.

    SUBSTRATE TREATMENT DEVICE
    9.
    发明申请

    公开(公告)号:US20210323036A1

    公开(公告)日:2021-10-21

    申请号:US17230152

    申请日:2021-04-14

    Abstract: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate the substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a first liquid supplier configured to supply a first liquid on a surface of the substrate, a second liquid supplier configured to supply a second liquid on the surface, and a controller controlling rotation of the substrate, supply of the cooling gas, the first and second liquids. The controller performs a preliminary process of supplying the second liquid on the surface, and supplying the cooling gas into the space, a liquid film forming process by supplying the first liquid toward the surface after the preliminary process, a supercooling process of the liquid film on the surface, and a freezing process of at least a part of the liquid film on the surface.

    SUBSTRATE TREATMENT DEVICE
    10.
    发明申请

    公开(公告)号:US20210265159A1

    公开(公告)日:2021-08-26

    申请号:US17181264

    申请日:2021-02-22

    Abstract: According to one embodiment, a substrate treatment device includes a placement stand configured to rotate a substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a liquid supplier configured to supply a liquid on a surface of the substrate opposite to the placement stand, and a controller controlling a rotation speed of the substrate, a flow rate of the cooling gas, or a supply amount of the liquid. The controller sets the liquid on the surface of the substrate to be in a supercooled state, forms a frozen film by freezing the liquid in the super cooled state, and causes crack to generate in the frozen film by decreasing a temperature of the frozen film.

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