Invention Grant
- Patent Title: Semiconductor device and a method for fabricating the same
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Application No.: US16722841Application Date: 2019-12-20
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Publication No.: US11127742B2Publication Date: 2021-09-21
- Inventor: Fang Chen , Jhon Jhy Liaw , Min-Chang Liang
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McDermott Will & Emery LLP
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L23/528 ; H01L21/8234 ; H01L29/51 ; H01L29/49 ; H01L21/768 ; H01L23/485 ; H01L23/532 ; H01L29/417 ; H01L29/78 ; H01L29/66 ; H01L27/02

Abstract:
A semiconductor device includes a fin field effect transistor. The semiconductor device includes a first gate electrode, a first source/drain (S/D) region disposed adjacent to the first gate electrode, a first S/D contact disposed on the first S/D region, a first spacer layer disposed between the first gate electrode and the first S/D region, a first contact layer in contact with the first gate electrode and the first S/D contact, and a first wiring layer integrally formed with the first contact layer. There is no interface between the first contact layer and the first wiring layer in a cross sectional view, and the first contact layer has a smaller area than the first wiring layer in plan view.
Information query
IPC分类: