Invention Grant
- Patent Title: Resin sheet production method
-
Application No.: US16436808Application Date: 2019-06-10
-
Publication No.: US11130262B2Publication Date: 2021-09-28
- Inventor: Hideki Takahashi
- Applicant: Casio Computer Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Casio Computer Co., Ltd.
- Current Assignee: Casio Computer Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Seed IP Law Group LLP
- Priority: JPJP2018-115556 20180618
- Main IPC: B29C35/08
- IPC: B29C35/08 ; H01H13/704 ; B29K101/12 ; H01H13/88

Abstract:
A resin sheet production method includes a preparation step of preparing a resin molding sheet including a base and a thermally expansive layer that is formed on one main surface of the base, the thermally expansive layer including a thermally expandable material; a heat conversion layer forming step of forming a heat conversion layer that converts electromagnetic waves to heat on at least one of the first main surface of the resin molding sheet or a second main surface on a side opposite to the first main surface; a pre-heating step of heating the resin molding sheet on which the heat conversion layer is formed to a temperature that is lower than an expansion starting temperature at which the thermally expandable material starts to expand; and a main heating step of irradiating the heat conversion layer of the resin molding sheet that is heated in the pre-heating step with the electromagnetic waves to cause the heat conversion layer to distend, thereby causing the base to deform and forming a shaped object on the resin molding sheet.
Public/Granted literature
- US20190381701A1 RESIN SHEET PRODUCTION METHOD Public/Granted day:2019-12-19
Information query
IPC分类: