An image pickup apparatus includes an imager, cover glass and a circuit element, the image pickup apparatus includes a first space filled with a first resin and a second space filled with a second resin, a thermal expansion coefficient of the second resin being smaller than a thermal expansion coefficient of the first resin, and when the image pickup apparatus is virtually divided into a plurality of unit columns, a ratio of the second space is larger in the unit columns in which a ratio of a space filled with resins is large than in the unit columns in which the ratio of the space filled with the resins is small.