公开(公告)号：US20190175004A1

公开(公告)日：2019-06-13

申请号：US16280335

申请日：2019-02-20

Applicant: Olympus Corporation

Inventor： Takuro Suyama ,  Takatoshi Igarashi ,  Kensuke Suga

IPC: A61B1/05 ,  H01L27/146 ,  H01L23/00 ,  H01L23/31 ,  A61B1/00 ,  A61B1/045

Abstract: The disclosed technology is directed to an imaging module of an endoscope comprises a plurality of semiconductor devices includes first and second semiconductor devices being electrically stacked to one another with a sealing layer interposed therebetween to transmit signals via a signal cable connected to a rear wall of the plurality of semiconductor devices. The first semiconductor device includes respective opposed first and second major surfaces having a first central region. The first major surface includes a semiconductor circuit portion disposed in the central region thereof. A through-silicon via is disposed in an intermediate region surrounding the first central region and is connected to the semiconductor circuit portion. The second major surface includes a first electrode located in the first central region thereof. The first electrode is connected to the through-silicon via. The second semiconductor device includes respective opposed third and fourth major surfaces having a second central region.

公开(公告)号：US10660511B2

公开(公告)日：2020-05-26

申请号：US16416522

申请日：2019-05-20

Applicant: OLYMPUS CORPORATION

Inventor： Takuro Suyama ,  Takatoshi Igarashi ,  Kensuke Suga ,  Yoshiro Nishimura

IPC: A61B1/04 ,  A61B1/05 ,  H01L23/00 ,  A61B1/00 ,  A61B1/045 ,  H01L23/31 ,  H04N5/225 ,  G02B23/24 ,  H01L27/146 ,  H01L23/48 ,  H01L23/538 ,  H04N5/369 ,  H01L21/768

Abstract: An image pickup module includes a plurality of semiconductor devices laminated via a sealing layer a signal is transmitted via a signal cable connected to a rear surface of the image pickup module, a first semiconductor device has a semiconductor circuit portion in a central area on a first principal plane, through wires in an intermediate area and first electrodes connected to the through wires in the central area on a second principal plane, the second semiconductor device has second electrodes in the central area on a third principal plane, and an external connection terminal to which the signal cable is connected, on a rear surface, and the sealing layer includes a first sealing layer arranged in the central area and a second sealing layer disposed in an outer circumferential area surrounding the intermediate area and with a Young's modulus smaller than a Young's modulus of the first sealing layer.

公开(公告)号：US11323598B2

公开(公告)日：2022-05-03

申请号：US16924280

申请日：2020-07-09

Applicant: OLYMPUS CORPORATION

Inventor： Ken Yamamoto ,  Takatoshi Igarashi ,  Takuro Suyama ,  Kazuhiro Yoshida ,  Kensuke Suga

IPC: H04N5/225 ,  A61B1/00 ,  A61B1/05 ,  G02B23/24 ,  H01L27/146

Abstract: An image pickup apparatus disposed in an endoscope includes an optical unit in which a plurality of optical members are stacked, an image pickup unit including an image pickup device and a plurality of semiconductor devices, mold resin covering the optical unit and the image pickup unit, and a wiring board bonded to the image pickup unit, in which a recess is provided on an outer peripheral surface of the mold resin.

公开(公告)号：US11133341B2

公开(公告)日：2021-09-28

申请号：US16687994

申请日：2019-11-19

Applicant: OLYMPUS CORPORATION

Inventor： Kensuke Suga

IPC: H01L27/146 ,  A61B1/00 ,  A61B1/05

Abstract: An image pickup apparatus includes an imager, cover glass and a circuit element, the image pickup apparatus includes a first space filled with a first resin and a second space filled with a second resin, a thermal expansion coefficient of the second resin being smaller than a thermal expansion coefficient of the first resin, and when the image pickup apparatus is virtually divided into a plurality of unit columns, a ratio of the second space is larger in the unit columns in which a ratio of a space filled with resins is large than in the unit columns in which the ratio of the space filled with the resins is small.