Invention Grant
- Patent Title: DMLM build release layer and method of use thereof
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Application No.: US15643312Application Date: 2017-07-06
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Publication No.: US11135653B2Publication Date: 2021-10-05
- Inventor: Todd Jay Rockstroh
- Applicant: GENERAL ELECTRIC COMPANY
- Applicant Address: US NY Schenectady
- Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee: GENERAL ELECTRIC COMPANY
- Current Assignee Address: US NY Schenectady
- Agency: Dority & Manning, P.A.
- Main IPC: B22F10/20
- IPC: B22F10/20 ; B33Y10/00 ; B33Y40/00 ; C25D5/34 ; C25F5/00 ; B22F12/00 ; B33Y30/00 ; B29C64/245 ; B22F10/10 ; B33Y70/00

Abstract:
A method for additive manufacturing utilizing a build plate with a release layer is provided. The method includes irradiating a first layer of powder in a powder bed to form a first fused region over a support. The first release layer is provided between the first fused region and the support. The method also includes providing a given layer of powder over the powder bed and irradiating the given layer of powder in the powder bed to form a given fused region. Providing the given layer of powder over the powder bed and irradiating the given layer of powder in the powder bed to form a given fused region are repeated until the object is formed in the powder bed. The object may be formed fusing individual layers with irradiation by laser or ebeam, or by binder jetting. The method further includes separating the object from the support by melting or dissolving the first release layer.
Public/Granted literature
- US20190009332A1 DMLM BUILD RELEASE LAYER AND METHOD OF USE THEREOF Public/Granted day:2019-01-10
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