Invention Grant
- Patent Title: Ultrasonic bonding apparatus and ultrasonic bonding method using the same
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Application No.: US16886993Application Date: 2020-05-29
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Publication No.: US11135779B2Publication Date: 2021-10-05
- Inventor: Hyun a Lee , Chan-Jae Park , Heeju Woo , Kikyung Youk , Sangduk Lee , Daehwan Jang
- Applicant: Samsung Display Co., Ltd.
- Applicant Address: KR Yongin-Si
- Assignee: Samsung Display Co., Ltd.
- Current Assignee: Samsung Display Co., Ltd.
- Current Assignee Address: KR Yongin-Si
- Agency: Cantor Colburn LLP
- Priority: KR10-2019-0120708 20190930
- Main IPC: B29C65/00
- IPC: B29C65/00 ; B29C65/08 ; H05K3/30

Abstract:
An ultrasonic bonding apparatus includes a stage on which a display panel is seated, a first ultrasonic generation unit which is connected to the stage and vibrates in a first direction and provide a first polarization, and a second ultrasonic generation unit in which an electronic component is seated and which vibrates in a second direction that is crossed with the first direction, and provides a second polarization, where a third polarization is provided on a plane on which the display panel contacts the electronic component.
Public/Granted literature
- US20210094238A1 ULTRASONIC BONDING APPARATUS AND ULTRASONIC BONDING METHOD USING THE SAME Public/Granted day:2021-04-01
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