Invention Grant
- Patent Title: Deposition mask and method of manufacturing deposition mask
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Application No.: US16512697Application Date: 2019-07-16
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Publication No.: US11136664B2Publication Date: 2021-10-05
- Inventor: Yasuhiro Uchida , Sachiyo Matsuura , Chikao Ikenaga
- Applicant: Dai Nippon Printing Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee: Dai Nippon Printing Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Burr & Brown, PLLC
- Priority: JPJP2017-005999 20170117,JPJP2017-238989 20171213
- Main IPC: C23C14/04
- IPC: C23C14/04 ; H01L51/56 ; H01L51/00 ; B05C21/00

Abstract:
A deposition mask includes: a first surface and a second surface, in which a plurality of through-holes are formed; a pair of long side surfaces connected to the first and second surfaces, and defining a profile of the deposition mask in a longitudinal direction of the deposition mask; and a pair of short side surfaces connected to the first and second surfaces, and defining a profile of the deposition mask in a width direction of the deposition mask. The long side surface includes a first portion that is recessed inside and includes a first end portion positioned along the first surface, and a second end portion positioned along the second surface and positioned inside the first end portion. The through-hole includes a first recess formed on the first surface, and a second recess formed on the second surface and connected to the first recess through a hole connection portion.
Information query
IPC分类: