Invention Grant
- Patent Title: Overmolded lead frame providing contact support and impedance matching properties
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Application No.: US16789520Application Date: 2020-02-13
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Publication No.: US11139620B2Publication Date: 2021-10-05
- Inventor: John A. Mongold , Jonathan E. Buck
- Applicant: Samtec, Inc.
- Applicant Address: US IN New Albany
- Assignee: Samtec, Inc.
- Current Assignee: Samtec, Inc.
- Current Assignee Address: US IN New Albany
- Agency: Keating & Bennett, LLP
- Main IPC: H01R13/6477
- IPC: H01R13/6477 ; H01R13/514 ; H01R13/646 ; H03H7/38 ; H01R12/72 ; H01R13/41 ; H01R13/631

Abstract:
An electrical connector includes first and second adjacent electrical contacts that each define respective first and second mating ends, the first mating end of a first one of the first and second adjacent electrical contacts defines a first contact surface, the second mating end of a second one of the first and second adjacent electrical contacts defines a second contact surface electrically isolated from the first contact surface; and a dielectric material positioned between the first and second adjacent electrical contacts. When a mating connector applies a force to the first contact surface and the second contact surface, the first and second mating ends and the dielectric material all move in a first direction.
Public/Granted literature
- US20200185862A1 OVERMOLDED LEAD FRAME PROVIDING CONTACT SUPPORT AND IMPEDANCE MATCHING PROPERTIES Public/Granted day:2020-06-11
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