公开(公告)号：US20250167497A1

公开(公告)日：2025-05-22

申请号：US19030281

申请日：2025-01-17

Applicant: SAMTEC, INC.

Inventor： Clarence L. Clyatt, III ,  Travis Ellis

IPC: H01R24/44 ,  H01R12/71 ,  H01R13/24 ,  H01R13/631

Abstract: A radio frequency (RF) electrical contact includes an electrical contact having a stationary electrical contact member and a movable electrical contact member that is received by the stationary electrical contact member. The movable electrical contact member is movable between an initial position and a mated position. The movable electrical contact member can contact the stationary electrical contact member at a stationary or fixed contact location.

公开(公告)号：US20250158301A1

公开(公告)日：2025-05-15

申请号：US19027626

申请日：2025-01-17

Applicant: SAMTEC, INC.

Inventor： Eric Zbinden ,  Jignesh H. Shah

IPC: H01R12/71 ,  H01R12/72 ,  H01R13/187

Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

公开(公告)号：US20250141161A1

公开(公告)日：2025-05-01

申请号：US19008974

申请日：2025-01-03

Applicant: SAMTEC, INC.

Inventor： Jonathan E. Buck ,  Yasuo Sasaki ,  Julian Ferry ,  Brandon Thomas Gore

IPC: H01R13/6598 ,  H01R4/70 ,  H01R12/62 ,  H01R12/75 ,  H01R13/03 ,  H01R13/6461 ,  H01R13/6585 ,  H01R13/6589

Abstract: An electrical contact for an electrical connector includes a contact body and a lossy material located on the contact body. An electrical connector includes contacts with a lossy material located on the contact body. A method of applying a lossy material to a contact for an electrical connector includes providing a contact and applying the lossy material to the contact.

公开(公告)号：US12283783B2

公开(公告)日：2025-04-22

申请号：US17675688

申请日：2022-02-18

Applicant: Samtec, Inc.

Inventor： Daniel R. Birch

IPC: H01R24/50 ,  H01R12/75 ,  H01R103/00

Abstract: An RF connector includes a single-piece housing with a mating end, a mounting end, and four walls, at least two consecutive ports defined by the housing, and a first conductor positioned in the first port of the at least two ports and a second conductor positioned in a second port of the at least two consecutive ports. The first conductor and the second conductor both only extend from the mating end to the mounting end.

公开(公告)号：US20250107029A1

公开(公告)日：2025-03-27

申请号：US18973393

申请日：2024-12-09

Applicant: Samtec, Inc.

Inventor： Burrell G. BEST ,  Brian R. VICICH ,  Kevin R. MEREDITH ,  Chadrick P. FAITH ,  Istvan NOVAK ,  Jonathan E. BUCK

IPC: H05K7/14 ,  H01F27/36 ,  H01R12/72 ,  H01R12/73 ,  H05K1/02 ,  H05K9/00

Abstract: A substrate reinforcement or stiffener can be toolless, slide-on, slide-off, and removable. A hold down can carry pre-attached solder balls, solder units, or fusible elements. Fusible elements can be shaped to reduce thermal and mechanical stresses when reflowed onto a substrate. A heat-producing article can include a heat-dissipation material selectively located on, or immediately adjacent to, a heat-producing article. Clips with a plurality of fingers can be added to power conductors. Graphene strips, graphene coatings, or nanomaterials can be applied to electrically non-conductive articles and are able to selectively direct unwanted heat away from the heat-producing article. Electro-magnetic interference can be reduced by selective placement of voids in a shield of an electrical component.

公开(公告)号：US20250087569A1

公开(公告)日：2025-03-13

申请号：US18549742

申请日：2022-03-10

Applicant: SAMTEC, INC.

Inventor： Thomas Jacob HAMMANN ,  Adam OWENS ,  Christopher BOHN ,  Nathan HAGAN ,  Nathan ROBERTSON ,  Peter WRSCHKA

IPC: H01L23/498

Abstract: Electrically conductive pastes are disclosed that are configured to fill a hole in a substrate. The paste can be cured in the hole so as to define an electrically conductive metallized via. Fills that perform at high temperatures are also disclosed.

公开(公告)号：US20250070008A1

公开(公告)日：2025-02-27

申请号：US18725118

申请日：2022-12-27

Applicant: MEDTRONIC, INC. ,  Samtec, Inc.

Inventor： Caian Qiu ,  David A. Ruben ,  Neha M. Patel ,  Patrick W. Kinzie ,  Tom Hammann ,  Chris Bohn

IPC: H01L23/498 ,  H01L21/48

Abstract: Various embodiments of an electrical component and a method of forming such electrical component are disclosed. The electrical component includes a substrate and one or more corrosion-resistant vias Each of the one or more corrosion-resistant vias includes one or more sidewalls formed by the substrate an interface layer disposed on at least a portion of the one or more sidewalls, and gold alloy bonded to the interface layer.

公开(公告)号：US12230902B2

公开(公告)日：2025-02-18

申请号：US17936013

申请日：2022-09-28

Applicant: SAMTEC, INC.

Inventor： Eric Zbinden ,  Jignesh H. Shah

IPC: H01R12/71 ,  H01R12/72 ,  H01R13/187

Abstract: A data communication system can include a low-profile electrical connector that is sized to be mounted onto a PCB in a gap between the PCB and a heat sink that overhangs from an IC that is mounted to the PCB. The data communication system further includes an electrical cable that extends from the electrical connector to an optical transceiver. A cable management laminate can route the electrical cables along a predetermined path. The data communication system can be disposed in a system tray that is configured to force air over the heat sink. The airflow over the heat sink can be adjustable.

公开(公告)号：US20240313451A1

公开(公告)日：2024-09-19

申请号：US18671033

申请日：2024-05-22

Applicant: Samtec, Inc.

Inventor： John A. MONGOLD ,  Jonathan E. BUCK ,  Jignesh H. SHAH ,  Chadrick P. FAITH ,  Randall E. MUSSER ,  Jean Karlo WILLIAMS BARNET ,  Norman S. MCMORROW

IPC: H01R12/79 ,  H01R13/518

CPC classification number: H01R12/79 ,  H01R13/518

Abstract: A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1RU panel I/O connector attached to the cable connector.

公开(公告)号：US11883057B2

公开(公告)日：2024-01-30

申请号：US17575219

申请日：2022-01-13

Applicant: Cilag GmbH International ,  SAMTEC INC.

Inventor： Eric Roberson ,  James E. Borgelt ,  Douglas E. McCartin

IPC: A61B17/32 ,  A61N7/02 ,  A61B90/00 ,  A61B17/00 ,  A61B18/00

CPC classification number: A61B17/320068 ,  A61B17/320092 ,  A61B90/03 ,  A61N7/02 ,  A61B2017/00477 ,  A61B2017/320071 ,  A61B2017/320094 ,  A61B2017/320095 ,  A61B2018/0063 ,  A61B2018/00345 ,  A61B2018/00601 ,  A61B2018/00619 ,  A61B2090/031

Abstract: A surgical instrument for use during a surgical procedure includes an instrument body, an ultrasonic transducer assembly extending along a longitudinal axis, a power cord, and a transducer slip joint. The ultrasonic transducer assembly is rotatably mounted within the instrument body about the longitudinal axis and defines a first outer profile. The power cord projects from the instrument body to provide electrical power to the ultrasonic transducer assembly for operating an acoustic waveguide. The transducer slip joint is positioned between the power cord and the ultrasonic transducer assembly and electrically and mechanically connects the power cord to the ultrasonic transducer assembly. The ultrasonic transducer assembly selectively rotates relative to the power cord for inhibiting the power cord from winding upon rotation of the ultrasonic transducer assembly. The transducer slip joint also defines a second outer profile that fits within the first outer profile of the ultrasonic transducer assembly.