- 专利标题: Apparatuses and methods for soft post-package repair
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申请号: US17062264申请日: 2020-10-02
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公开(公告)号: US11145387B2公开(公告)日: 2021-10-12
- 发明人: Alan J. Wilson
- 申请人: MICRON TECHNOLOGY, INC.
- 申请人地址: US ID Boise
- 专利权人: MICRON TECHNOLOGY, INC.
- 当前专利权人: MICRON TECHNOLOGY, INC.
- 当前专利权人地址: US ID Boise
- 代理机构: Dorsey & Whitney LLP
- 主分类号: G11C29/00
- IPC分类号: G11C29/00 ; G11C29/02 ; G11C29/32 ; G11C17/18 ; G11C11/408 ; G11C7/22 ; G11C7/10 ; G11C11/4076 ; G11C29/44
摘要:
Embodiments of the disclosure are drawn to apparatuses and methods for soft post-package repair (SPPR). After packaging, it may be necessary to perform post-package repair operations on rows of the memory. During a scan mode of an SPPR operation, addresses provided by a fuse bank may be examined to determine if they are open addresses or if the bad row of memory is a redundant row of memory. The open addresses and the bad redundant addresses may be stored in volatile storage elements, such as in latch circuits. During a soft send mode of a SPPR operation, the address previously associated with the bad row of memory may be associated with the open address instead, and the address of the bad redundant row may be disabled.
公开/授权文献
- US20210020261A1 APPARATUSES AND METHODS FOR SOFT POST-PACKAGE REPAIR 公开/授权日:2021-01-21
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