Invention Grant
- Patent Title: Apparatuses and methods for soft post-package repair
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Application No.: US17062264Application Date: 2020-10-02
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Publication No.: US11145387B2Publication Date: 2021-10-12
- Inventor: Alan J. Wilson
- Applicant: MICRON TECHNOLOGY, INC.
- Applicant Address: US ID Boise
- Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee: MICRON TECHNOLOGY, INC.
- Current Assignee Address: US ID Boise
- Agency: Dorsey & Whitney LLP
- Main IPC: G11C29/00
- IPC: G11C29/00 ; G11C29/02 ; G11C29/32 ; G11C17/18 ; G11C11/408 ; G11C7/22 ; G11C7/10 ; G11C11/4076 ; G11C29/44

Abstract:
Embodiments of the disclosure are drawn to apparatuses and methods for soft post-package repair (SPPR). After packaging, it may be necessary to perform post-package repair operations on rows of the memory. During a scan mode of an SPPR operation, addresses provided by a fuse bank may be examined to determine if they are open addresses or if the bad row of memory is a redundant row of memory. The open addresses and the bad redundant addresses may be stored in volatile storage elements, such as in latch circuits. During a soft send mode of a SPPR operation, the address previously associated with the bad row of memory may be associated with the open address instead, and the address of the bad redundant row may be disabled.
Public/Granted literature
- US20210020261A1 APPARATUSES AND METHODS FOR SOFT POST-PACKAGE REPAIR Public/Granted day:2021-01-21
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