Invention Grant
- Patent Title: Sensing module
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Application No.: US16286612Application Date: 2019-02-27
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Publication No.: US11148336B2Publication Date: 2021-10-19
- Inventor: Meng-Chiao Tsai , Feng-Chia Hsu , Chung-Yuan Su , Peng-Jen Chen
- Applicant: Industrial Technology Research Institute
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW107147183 20181226
- Main IPC: B29C45/78
- IPC: B29C45/78 ; B29C45/26 ; G01L19/00

Abstract:
A sensing module includes a hollow body, a first photo sensor, and a second photo sensor. The hollow body includes a cavity portion and an insertion portion connected to each other. The insertion portion has a first channel and a second channel. The first photo sensor is disposed in the cavity portion of the hollow body and corresponds to the first channel to sense an ambient temperature and a test object temperature. The second photo sensor is disposed in the cavity portion of the hollow body and corresponds to the second channel to sense the ambient temperature.
Public/Granted literature
- US20200206999A1 SENSING MODULE Public/Granted day:2020-07-02
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