The present invention provides a photocurable resin composition containing a polymer (A) which has excellent adhesion to plastic substrates. The present invention relates to a photocurable resin composition that contains a polymer (A) produced by polymerization of a compound represented by the following formula [I]: wherein each R1 may be the same or different and represents a hydrogen atom, a C1-C5 alkyl group, a glycidyl group, or the group —CH2—CR3═CHR2 wherein R2 and R3 each represent H or CH3, provided that at least one R1 is the group —CH2—CR3═CHR2.