Invention Grant
- Patent Title: Integrated circuit including vertical capacitors
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Application No.: US16823414Application Date: 2020-03-19
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Publication No.: US11152068B2Publication Date: 2021-10-19
- Inventor: Xiang-Zheng Bo , Patrick R. Smith , Douglas T. Grider
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Andrew R. Ralston; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L29/78
- IPC: H01L29/78 ; G11C16/04 ; H01L27/1156 ; H01L27/108 ; H01L27/118
Abstract:
In some examples, an integrated circuit comprises a first plate, a second plate, and a dielectric layer disposed between the first and second plates, the first and second plates and the dielectric layer forming a vertical capacitor, wherein the first and second plates and the dielectric layer of the vertical capacitor are disposed on an isolation region of the integrated circuit.
Public/Granted literature
- US20200219566A1 INTEGRATED CIRCUIT INCLUDING VERTICAL CAPACITORS Public/Granted day:2020-07-09
Information query
IPC分类:
