Invention Grant
- Patent Title: Electronic component
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Application No.: US16820138Application Date: 2020-03-16
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Publication No.: US11152154B2Publication Date: 2021-10-19
- Inventor: Yuichi Nagai , Atsushi Takeda , Takehisa Tamura , Shinya Onodera
- Applicant: TDK CORPORATION
- Applicant Address: JP Tokyo
- Assignee: TDK CORPORATION
- Current Assignee: TDK CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Oliff PLC
- Priority: JPJP2019-056112 20190325
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/248 ; H01G4/30

Abstract:
An electronic component includes an element body and an external electrode. The element body includes a side surface and an end surface. The external electrode includes a conductive resin layer disposed over the side surface and the end surface. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm), a maximum thickness of the second region is T2 (μm), and a minimum thickness of the third region is T3 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1≥0.11, and the maximum thickness T1 and the minimum thickness T3 satisfy a relation of T3/T1≥0.11.
Public/Granted literature
- US20200312563A1 ELECTRONIC COMPONENT Public/Granted day:2020-10-01
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