公开(公告)号：US20250132094A1

公开(公告)日：2025-04-24

申请号：US18827935

申请日：2024-09-09

Applicant: TDK Corporation

Inventor： Natsumi KATO ,  Ken Morita ,  Shinya Onodera ,  Yuichi Nagai

IPC: H01G4/232 ,  H01G4/012 ,  H01G4/30

Abstract: An electronic component includes an element body, a plurality of external electrode each including a conductive resin layer, a plurality of internal electrodes each electrically connected to a corresponding external electrode of the plurality of external electrodes, and an electrical insulation film disposed on the element body. The element body includes a pair of end surfaces, and a first side surface and a second side surface adjacent to each other and to the pair of end surfaces. The element body includes a first region positioned away from the first side surface, and a second region including the first side surface and having a dielectric constant smaller than a dielectric constant of the first region. The plurality of internal electrodes are disposed in the first region. The electrical insulation film includes a film portion positioned on a region, of the second side surface, between the conductive resin layers.

公开(公告)号：US11335505B2

公开(公告)日：2022-05-17

申请号：US16724712

申请日：2019-12-23

Applicant: TDK CORPORATION

Inventor： Shinya Onodera ,  Takehisa Tamura ,  Atsushi Takeda ,  Yuichi Nagai

IPC: H01G4/248 ,  H01G4/30 ,  H01G4/012

Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a conductive resin layer, a solder plating layer arranged to constitute an outermost layer of the external electrode, and an intermediate plating layer disposed between the conductive resin layer and the solder plating layer. The intermediate plating layer has better solder leach resistance than metal contained in the conductive resin layer. An opening is formed in the intermediate plating layer. The solder plating layer is formed on the conductive resin layer through the opening.

公开(公告)号：US11328866B2

公开(公告)日：2022-05-10

申请号：US16819761

申请日：2020-03-16

Applicant: TDK CORPORATION

Inventor： Yuichi Nagai ,  Atsushi Takeda ,  Takehisa Tamura ,  Shinya Onodera

IPC: H01G4/005 ,  H01G4/33

Abstract: An electronic component includes an element body and an external electrode. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on a ridge portion between the end surface and the principal surface, and a third region positioned on the principal surface. In a case where a maximum thickness of the first region is T1 (μm) and a minimum thickness of the second region is T2 (μm), the maximum thickness T1 and the minimum thickness T2 satisfy a relation of T2/T1≥0.26.

公开(公告)号：US11152154B2

公开(公告)日：2021-10-19

申请号：US16820138

申请日：2020-03-16

Applicant: TDK CORPORATION

Inventor： Yuichi Nagai ,  Atsushi Takeda ,  Takehisa Tamura ,  Shinya Onodera

IPC: H01G4/232 ,  H01G4/248 ,  H01G4/30

Abstract: An electronic component includes an element body and an external electrode. The element body includes a side surface and an end surface. The external electrode includes a conductive resin layer disposed over the side surface and the end surface. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm), a maximum thickness of the second region is T2 (μm), and a minimum thickness of the third region is T3 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1≥0.11, and the maximum thickness T1 and the minimum thickness T3 satisfy a relation of T3/T1≥0.11.

公开(公告)号：US11217391B2

公开(公告)日：2022-01-04

申请号：US16819779

申请日：2020-03-16

Applicant: TDK CORPORATION

Inventor： Yuichi Nagai ,  Atsushi Takeda ,  Takehisa Tamura ,  Shinya Onodera

IPC: H01G4/005 ,  H01G4/30 ,  H01G4/12 ,  H05K3/34 ,  H01G4/232

Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The element body includes a principal surface arranged to constitute a mounting surface and an end surface adjacent to the principal surface. The external electrode includes a conductive resin layer disposed to continuously cover a part of the principal surface and a part of the end surface, and a plating layer covering the conductive resin layer. The conductive resin layer includes a first region positioned on the end surface and a second region positioned on the principal surface. A maximum thickness of the second region is larger than a maximum thickness of the first region.

公开(公告)号：US10964479B2

公开(公告)日：2021-03-30

申请号：US16724441

申请日：2019-12-23

Applicant: TDK CORPORATION

Inventor： Shinya Onodera ,  Takehisa Tamura ,  Atsushi Takeda ,  Yuichi Nagai

IPC: H01G4/232 ,  H01G4/30 ,  H01G4/248 ,  H01G4/008 ,  H01G4/12

Abstract: An electronic component includes an element body and an external electrode disposed on the element body. The external electrode includes a sintered metal layer, a conductive resin layer disposed on the sintered metal layer, and a solder plating layer arranged to constitute an outermost layer of the external electrode. A space exists in the conductive resin layer or between the conductive resin layer and the sintered metal layer. A first maximum length of the space in a thickness direction of the conductive resin layer is shorter than a second maximum length of the space in a direction orthogonal to the thickness direction of the conductive resin layer.

公开(公告)号：US11264171B2

公开(公告)日：2022-03-01

申请号：US16986712

申请日：2020-08-06

Applicant: TDK CORPORATION

Inventor： Yuichi Nagai ,  Takehisa Tamura ,  Shinya Onodera ,  Ken Morita ,  Atsushi Takeda

IPC: H01G4/248 ,  H01G4/12 ,  H01G4/012 ,  H01G4/30

Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm) and a maximum thickness of the second region is T2 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1≥0.11. In a cross-section along a thickness direction of the first region, a total area of voids in the first region is in a range of 5.0 to 36.0% of an area of the first region. In a cross-section along a thickness direction of the second region, a total area of voids in the second region is in the range of 5.0 to 36.0% of an area of the second region.

公开(公告)号：US11289271B2

公开(公告)日：2022-03-29

申请号：US16986588

申请日：2020-08-06

Applicant: TDK CORPORATION

Inventor： Yuichi Nagai ,  Takehisa Tamura ,  Shinya Onodera ,  Ken Morita ,  Atsushi Takeda

IPC: H01G4/008 ,  H01G4/30 ,  H01G4/232

Abstract: A conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm) and a maximum thickness of the second region is T2 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation of T2/T1≥0.11. In a cross-section along a thickness direction of the third region, a total area of the voids in the third region is in a range of 3.0 to 11.0% of an area of the third region.

公开(公告)号：US12293874B2

公开(公告)日：2025-05-06

申请号：US17939819

申请日：2022-09-07

Applicant: TDK CORPORATION

Inventor： Yuichi Nagai ,  Natsumi Kato ,  Akitoshi Yoshii ,  Ken Morita ,  Takehisa Tamura ,  Atsushi Takeda

IPC: H01G4/012 ,  H01G4/232 ,  H01G4/30

Abstract: Each of a plurality of internal electrodes is electrically connected to a corresponding external electrode of a plurality of external electrodes. A plurality of auxiliary internal electrodes are disposed in the same layer as the plurality of internal electrodes to be located between each of a pair of side surfaces and the plurality of internal electrodes. Each of the plurality of external electrodes includes a pair of side surface electrode portions disposed on the pair of side surfaces and including a conductive resin layer. Each of the plurality of auxiliary internal electrodes is electrically connected to the external electrode to which the internal electrode located in the same layer is not electrically connected, and is located between the conductive resin layer to which the internal electrode located in the same layer is not electrically connected and the internal electrode located in the same layer.