Invention Grant
- Patent Title: Electrically conductive adhesive and electrically conductive material
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Application No.: US15711284Application Date: 2017-09-21
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Publication No.: US11162004B2Publication Date: 2021-11-02
- Inventor: Teppei Kunimune , Masafumi Kuramoto
- Applicant: Nichia Corporation
- Applicant Address: JP Anan
- Assignee: Nichia Corporation
- Current Assignee: Nichia Corporation
- Current Assignee Address: JP Anan
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JPJP2016-186115 20160923
- Main IPC: C09J9/02
- IPC: C09J9/02 ; C08K3/08 ; C09J171/02

Abstract:
Disclosed is an electrically conductive adhesive containing: (A) a polyether polymer having a backbone comprising a repeating unit of the formula: —R1—O— wherein R1 is a hydrocarbon group having 1 to 10 carbon atoms, and an end group which is a hydrolyzable silyl group, and (B) silver particles. Further disclosed is an electrically conductive material which is a hardened product of the electrically conductive adhesive.
Public/Granted literature
- US20180086950A1 ELECTRICALLY CONDUCTIVE ADHESIVE AND ELECTRICALLY CONDUCTIVE MATERIAL Public/Granted day:2018-03-29
Information query
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