- 专利标题： Solder reflow apparatus and method of manufacturing an electronic device
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申请号： US16138120申请日： 2018-09-21
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公开(公告)号： US11166351B2公开(公告)日： 2021-11-02
- 发明人: Sin-Yeob Lee , Dong-Woo Shin , Hyun-Seok Choi
- 申请人： Samsung Electronics Co., Ltd.
- 申请人地址： KR Suwon-si
- 专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人： Samsung Electronics Co., Ltd.
- 当前专利权人地址： KR Suwon-si
- 代理机构： Muir Patent Law, PLLC
- 优先权： KR10-2017-0166361 20171206
- 主分类号： H05B6/64
- IPC分类号： H05B6/64 ; H01L21/263 ; H01L21/324 ; H01L21/67 ; H01L25/00 ; H01L25/10 ; H05B6/80 ; H01L23/00
摘要：
In a method of manufacturing an electronic device, a solder paste is coated on a substrate pad of a substrate. An electronic product is disposed on the substrate such that a solder on an input/output pad of the electronic product makes contact with the solder paste. A first microwave is generated toward the solder paste during a reflow stage to heat the solder paste. A phase of the first microwave is changed during the reflow stage. Heating of the solder paste causes the solder to reflow, thereby forming a solder bump between the substrate pad and the input/output pad.
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