- Patent Title: Printed circuit board and semiconductor package including the same
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Application No.: US16787712Application Date: 2020-02-11
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Publication No.: US11166368B2Publication Date: 2021-11-02
- Inventor: Jung Ho Park , In Won O , Hak Jun Kim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2019-0016018 20190212
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L25/065 ; H05K1/02 ; H05K1/11

Abstract:
A printed circuit board that includes a base layer having a first surface and a second surface opposing each other. A first structure is disposed on the first surface of the base layer. The first structure includes a first plate structure. A first connection structure is disposed on a same plane as the first plate structure and is spaced apart from the first plate structure. The first plate structure includes first openings. At least some of the first openings are linear openings having a line shape.
Public/Granted literature
- US20200260577A1 PRINTED CIRCUIT BOARD AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME Public/Granted day:2020-08-13
Information query
IPC分类: