Invention Grant
- Patent Title: Flexible module with improved bending at COF end of panel thereof and a method for fabricating the same
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Application No.: US15760401Application Date: 2017-09-14
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Publication No.: US11169403B2Publication Date: 2021-11-09
- Inventor: Hong Li , Pao Ming Tsai
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Dinsmore & Shohl LLP
- Priority: CN201710135802.7 20170308
- International Application: PCT/CN2017/101726 WO 20170914
- International Announcement: WO2018/161520 WO 20180913
- Main IPC: G02F1/1333
- IPC: G02F1/1333 ; G09F9/30
Abstract:
The present disclosure discloses a flexible module and a method for fabricating the same. The method comprises: attaching a bottom film to a back surface of a flexible panel with an adhesive layer; at least removing the bottom film on the back surface of a bending area of the flexible panel; and bending the flexible panel so that the bending area of the flexible panel bends to complete the fabrication of the flexible module.
Public/Granted literature
- US20200233245A1 A FLEXIBLE MODULE AND A METHOD FOR FABRICATING THE SAME Public/Granted day:2020-07-23
Information query
IPC分类:
