Invention Grant
- Patent Title: Method and system for alignment of wire contact with wire contact insertion holes of a connector
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Application No.: US16536622Application Date: 2019-08-09
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Publication No.: US11171459B2Publication Date: 2021-11-09
- Inventor: Heiko Hoffmann
- Applicant: The Boeing Company
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Alston & Bird LLP
- Main IPC: H01R43/20
- IPC: H01R43/20 ; G06T7/73 ; G06T7/13 ; B25J9/16 ; G06T7/00

Abstract:
A method, system and computer program product are provided for aligning wire contacts with wire contact insertion holes of a connector to facilitate the automated insertion of the wire ends of a wire bundle assembly into the wire contact insertion holes of a connector. Methods may include: obtaining captured images from at least two image capture devices attached to an end-effector of a robot of a wire gripper of the end-effector; detecting, within at least one image from each of the at least two image capture devices, a wire contact; detecting, within at least one image from each of the at least two image capture devices, one or more insertion holes of the connector; identifying corrective movement for the robot end-effector that aligns a target hole of the one or more insertion holes of the connector with the wire connector; and causing the robot to move the end-effector according to the identified corrective movement.
Public/Granted literature
- US20210044069A1 METHOD AND SYSTEM FOR ALIGNMENT OF WIRE CONTACT WITH WIRE CONTACT INSERTION HOLES OF A CONNECTOR Public/Granted day:2021-02-11
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