Invention Grant
- Patent Title: Substrate processing methods
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Application No.: US16420725Application Date: 2019-05-23
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Publication No.: US11174549B2Publication Date: 2021-11-16
- Inventor: Sun-Cheul Kim , Kap-Soo Lee , Keun-Young Lee , Hong-Taek Lim , Jeong-Woo Hyun , Dong-Hoon Han
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Myers Bigel, P.A.
- Priority: KR10-2018-0133556 20181102
- Main IPC: C23C16/02
- IPC: C23C16/02 ; C23C16/44 ; C23C16/50 ; C23C16/06 ; C23C16/34 ; H01L21/285 ; H01J37/32 ; H01L27/11556 ; H01L27/11582

Abstract:
In a substrate processing method, a cleaning process is performed at a first temperature to remove a portion of a cumulative layer that is deposited within a chamber by deposition processes (step 1). The deposition processes are performed at the first temperature on a plurality of substrates within the chamber respectively (step 2). The step 1 and the step 2 are performed alternately and repeatedly.
Information query
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