Invention Grant
- Patent Title: Multilayer capacitor and board having the same mounted thereon
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Application No.: US16779960Application Date: 2020-02-03
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Publication No.: US11177072B2Publication Date: 2021-11-16
- Inventor: Sim Chung Kang , Yong Park , Woo Chul Shin , Ki Pyo Hong
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0100293 20190816
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G2/06 ; H01G4/12 ; H01G4/012

Abstract:
A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively connected to the third surface and the fourth surface of the capacitor body to be respectively connected to the first internal electrode and the second internal electrode. The first and second side portions include an acicular second phase including a glass including aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P).
Public/Granted literature
- US20210050154A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON Public/Granted day:2021-02-18
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