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    Multilayer capacitor and board having the same mounted thereon
    2.
    发明授权
    Multilayer capacitor and board having the same mounted thereon 有权

    公开(公告)号：US11694847B2

    公开(公告)日：2023-07-04

    申请号：US17697172

    申请日：2022-03-17

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sim Chung Kang ,  Yong Park ,  Woo Chul Shin ,  Ki Pyo Hong

    IPC: H01G2/06 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/008 ,  H01G4/012 ,  H01G4/1218

    Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively be connected to the first internal electrode and the second internal electrode. The first and second side portions comprise an acicular second phase including a glass comprising aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P), and a volume of the second phase is 30% or more with respect to the entire first and second side portions.

    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME
    3.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20220148806A1

    公开(公告)日：2022-05-12

    申请号：US17586322

    申请日：2022-01-27

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Eun Jung Lee ,  Jong Ho Lee ,  Sim Chung Kang ,  Ki Pyo Hong

    IPC: H01G4/12 ,  H01G4/30 ,  H01G4/012 ,  H01G4/248

    Abstract: A multilayer ceramic capacitor includes a ceramic body having a dielectric layer, a plurality of internal electrodes disposed in the ceramic body, and a first side margin portion and a second side margin portion arranged on end portions of the internal electrodes exposed through respective opposing surfaces of the ceramic body. The ceramic body includes an active portion having the plurality of internal electrodes arranged to overlap each other with the dielectric layer interposed therebetween to form capacitance, and cover portions disposed above an uppermost and below a lowermost internal electrode of the active portion. The first and second side margin portions include tin (Sn), and a content of Sn included in the first and second side margin portions is greater than a content of Sn included in the dielectric layer of the active portion.

    MULTILAYER CAPACITOR
    4.
    发明申请
    MULTILAYER CAPACITOR 有权

    公开(公告)号：US20220139632A1

    公开(公告)日：2022-05-05

    申请号：US17517142

    申请日：2021-11-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Jin Woo KIM ,  Eun Jung Lee ,  Jong Suk Jeong ,  Chun Hee Seo ,  Jong Hoon Yoo ,  Tae Hyung Kim ,  Ho Sam Choi ,  Sim Chung Kang

    IPC: H01G4/30 ,  H01G4/012 ,  H01G4/12 ,  H01G4/224

    Abstract: A multilayer capacitor includes a body including a plurality of dielectric layers and a plurality of internal electrodes stacked in a first direction, and external electrodes, wherein the body includes an active portion, a side margin portion covering at least one of a first surface and a second surface of the active portion opposing each other in a second direction, and a cover portion covering the active portion in the first direction, respective dielectric layers among the plurality of dielectric layers include a barium titanate-based composition, the dielectric layer of the side margin portion includes Sn, and a content of Sn in the dielectric layer of the side margin portion is different from that of Sn in the dielectric layer of the active portion, and the dielectric layer of the side margin portion includes at least some grains having a core-shell structure.

    Multilayer ceramic capacitor and method of manufacturing the same
    6.
    发明授权
    Multilayer ceramic capacitor and method of manufacturing the same 有权

    公开(公告)号：US11923146B2

    公开(公告)日：2024-03-05

    申请号：US18139007

    申请日：2023-04-25

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Eun Jung Lee ,  Jong Ho Lee ,  Sim Chung Kang ,  Ki Pyo Hong

    IPC: H01G4/12 ,  H01G4/012 ,  H01G4/248 ,  H01G4/30

    CPC classification number: H01G4/1227 ,  H01G4/012 ,  H01G4/248 ,  H01G4/30

    Abstract: A multilayer ceramic capacitor includes a ceramic body having a dielectric layer, a plurality of internal electrodes disposed in the ceramic body, and a first side margin portion and a second side margin portion arranged on end portions of the internal electrodes exposed through respective opposing surfaces of the ceramic body. The ceramic body includes an active portion having the plurality of internal electrodes arranged to overlap each other with the dielectric layer interposed therebetween to form capacitance, and cover portions disposed above an uppermost and below a lowermost internal electrode of the active portion. The first and second side margin portions include tin (Sn), and a content of Sn included in the first and second side margin portions is greater than a content of Sn included in the dielectric layer of the active portion.

    Multilayer capacitor and board having the same mounted thereon
    8.
    发明授权
    Multilayer capacitor and board having the same mounted thereon 有权

    公开(公告)号：US11682528B2

    公开(公告)日：2023-06-20

    申请号：US17501227

    申请日：2021-10-14

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Sim Chung Kang ,  Yong Park ,  Woo Chul Shin ,  Ki Pyo Hong

    IPC: H01G4/30 ,  H01G2/06 ,  H01G4/12 ,  H01G4/012

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/012 ,  H01G4/1209

    Abstract: A multilayer capacitor includes a capacitor body including dielectric layers and first and second internal electrodes, the capacitor body having first to sixth surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, and the second internal electrode being exposed through the fourth, fifth, and sixth surfaces, a first side portion and a second side portion, respectively disposed on the fifth surface and the sixth surface of the capacitor body, and a first external electrode and a second external electrode, respectively connected to the third surface and the fourth surface of the capacitor body to be respectively connected to the first internal electrode and the second internal electrode. The first and second side portions include an acicular second phase including a glass including aluminum (Al) and silicon (Si), manganese (Mn), and phosphorus (P).

    Multilayered capacitor and board having the same mounted thereon
    9.
    发明授权
    Multilayered capacitor and board having the same mounted thereon 有权

    公开(公告)号：US11495410B2

    公开(公告)日：2022-11-08

    申请号：US16855274

    申请日：2020-04-22

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Yong Park ,  Sim Chung Kang ,  Jong Ho Lee ,  Hyung Soon Kwon ,  Woo Chul Shin

    IPC: H01G4/30 ,  H01G4/012 ,  H01G4/248 ,  H01G4/12 ,  H01G4/232

    Abstract: A multilayer capacitor includes: a capacitor body including first and second internal electrodes alternately stacked with a dielectric layer interposed therebetween, and having first to six surfaces, the first internal electrode being exposed through the third, fifth, and sixth surfaces, the second internal electrode being exposed through the fourth, fifth, and sixth surfaces; first and second side portions disposed on the fifth and sixth surfaces of the capacitor body; and first and second external electrodes. The capacitor body includes upper and lower cover portions disposed on an upper surface of an uppermost internal electrode and a lower surfaces of a lowermost internal electrode, respectively, in a stacking direction of the first and second internal electrodes. The first and second side portions and the upper and lower cover portions include zirconium (Zr).

    MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    10.
    发明申请
    MULTILAYER ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20220223344A1

    公开(公告)日：2022-07-14

    申请号：US17476995

    申请日：2021-09-16

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Dong Jun Jung ,  Yun Kim ,  Hyun Kim ,  Sim Chung Kang ,  Eun Jung Lee

    IPC: H01G4/008 ,  H01G4/30 ,  H01G4/012 ,  H01G4/12

    Abstract: A multilayer electronic component includes: a body including dielectric layers and having first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; side margin portions disposed on the fifth and sixth surfaces, respectively; and external electrodes disposed on the third and fourth surfaces, respectively. The body includes an active portion including internal electrodes disposed alternately with the dielectric layers in the first direction, one of the internal electrodes includes a central portion and an interface portion disposed between the central portion and one of the dielectric layers, and the interface portion and one of the side margin portions include Sn.

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