Invention Grant
- Patent Title: Method of filling recess
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Application No.: US16690958Application Date: 2019-11-21
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Publication No.: US11177133B2Publication Date: 2021-11-16
- Inventor: Satoshi Takagi , Yoshimasa Watanabe
- Applicant: TOKYO ELECTRON LIMITED
- Applicant Address: JP Tokyo
- Assignee: TOKYO ELECTRON LIMITED
- Current Assignee: TOKYO ELECTRON LIMITED
- Current Assignee Address: JP Tokyo
- Agency: Nath, Goldberg & Meyer
- Agent Jerald L. Meyer; Tanya E. Harkins
- Priority: JPJP2018-218602 20181121
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/268
Abstract:
A method of filling a recess according to one embodiment of the present disclosure comprises heating an amorphous semiconductor film without crystallizing the amorphous semiconductor film by radiating laser light to the amorphous semiconductor film embedded in the recess.
Public/Granted literature
- US20200161135A1 Method of Filling Recess Public/Granted day:2020-05-21
Information query
IPC分类:
