Invention Grant
- Patent Title: C-fed antenna formed on multi-layer printed circuit board edge
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Application No.: US16099979Application Date: 2016-05-10
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Publication No.: US11177573B2Publication Date: 2021-11-16
- Inventor: Zhinong Ying
- Applicant: Sony Mobile Communications Inc.
- Applicant Address: JP Tokyo
- Assignee: Sony Mobile Communications Inc.
- Current Assignee: Sony Mobile Communications Inc.
- Current Assignee Address: JP Tokyo
- Agency: Tucker Ellis LLP
- International Application: PCT/EP2016/060427 WO 20160510
- International Announcement: WO2017/194096 WO 20171116
- Main IPC: H01Q9/04
- IPC: H01Q9/04 ; H01Q21/28 ; H01Q21/30 ; H01Q9/28

Abstract:
C-fed antenna formed on multi-layer printed circuit board edge A patch antenna (120) comprises an antenna patch (121) and a feeding patch (125) configured for capacitive feeding of the antenna patch (121). The antenna patch (121) is formed of multiple conductive strips (122) extending in a horizontal direction along an edge of a multi-layer printed circuit board (PCB). The multi-layer PCB has multiple layers stacked along a vertical direction. Each of the conductive strips (122) of the antenna patch (121) is arranged on a different layer of the multi-layer PCB. The conductive strips (122) are electrically connected to each other by conductive vias (123) extending between two or more of the conductive strips (122) of the antenna patch (121). The feeding patch (125) is formed of multiple conductive strips (126) extending in the horizontal direction. Each of the conductive strips (126) of the feeding patch (125) is arranged on a different layer of the multilayer PCB. The conductive strips (126) of the feeding patch are electrically connected to each other by conductive vias (127) extending between two or more of the conductive strips (126) of the feeding patch (125).
Public/Granted literature
- US20200313300A1 C-FED ANTENNA FORMED ON MULTI-LAYER PRINTED CIRCUIT BOARD EDGE Public/Granted day:2020-10-01
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