发明授权
- 专利标题: Microphone module
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申请号: US16761156申请日: 2018-09-27
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公开(公告)号: US11178476B2公开(公告)日: 2021-11-16
- 发明人: Mingxu Ou
- 申请人: GOERTEK INC.
- 申请人地址: CN Shandong
- 专利权人: GOERTEK INC.
- 当前专利权人: GOERTEK INC.
- 当前专利权人地址: CN Shandong
- 代理机构: Paratus Law Group, PLLC
- 优先权: CN201721696750.2 20171208
- 国际申请: PCT/CN2018/107865 WO 20180927
- 国际公布: WO2019/109715 WO 20190613
- 主分类号: H04R1/02
- IPC分类号: H04R1/02 ; H04R1/08 ; H04R1/04
摘要:
The present invention discloses a microphone module. The module comprises: a housing having a sound receiving hole; a pressing plate fixedly combined with the housing, an accommodating cavity being formed between the inner side surface of the pressing plate and the outer side surface of the housing, and the pressing plate comprising sound transmitting hole corresponding to the sound receiving hole; and an intermediate layer covering the sound receiving hole, provided on the outer or inner side surface of the housing, and corresponding to the sound receiving hole. The housing further comprises an annular protrusion having a passage, extending outwards from the outer side surface of the housing, and surrounding the sound receiving hole. According to the microphone module provided in the present invention, by combining the sound transmitting hole with the annular protrusion having the passage, the vibration amplitude of the intermediate layer remains small even when the microphone module is subjected to high-pressure water impact, such that deformation and breaking of the intermediate layer are avoided. Therefore, the influence on the acoustic performance and waterproof performance of the microphone module is reduced.
公开/授权文献
- US20200275179A1 MICROPHONE MODULE 公开/授权日:2020-08-27
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