- Patent Title: Selective dielectric resin application on circuitized core layers
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Application No.: US16029114Application Date: 2018-07-06
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Publication No.: US11178757B2Publication Date: 2021-11-16
- Inventor: Bruce J. Chamberlin , Matthew S. Kelly , Scott B. King , Joseph Kuczynski
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agent Nathan M. Rau
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/09 ; H05K1/11 ; H05K3/42 ; H05K3/46 ; H05K3/00 ; H05K1/02 ; H05K1/14
Abstract:
A process of manufacturing a multiple-layer printed circuit board includes selectively applying a dielectric resin to a region of a circuitized core layer. The process also includes partially curing the dielectric resin prior to performing a lamination cycle to form the multiple-layer printed circuit board that includes the circuitized core layer.
Public/Granted literature
- US20190191559A1 SELECTIVE DIELECTRIC RESIN APPLICATION ON CIRCUITIZED CORE LAYERS Public/Granted day:2019-06-20
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