Invention Grant
- Patent Title: Metal enclosure of mobile device, production method for metal enclosure, and mobile device
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Application No.: US16366726Application Date: 2019-03-27
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Publication No.: US11178785B2Publication Date: 2021-11-16
- Inventor: Wenming Shi , Wangchun Lv , Yongxiang Wang , Kaiwen Huang
- Applicant: HUAWEI TECHNOLOGIES CO., LTD.
- Applicant Address: CN Guangdong
- Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee: HUAWEI TECHNOLOGIES CO., LTD.
- Current Assignee Address: CN Guangdong
- Agency: Fish & Richardson P.C.
- Priority: CN201610867934.4 20160928
- Main IPC: H01Q1/27
- IPC: H01Q1/27 ; H05K5/04 ; H05K5/00 ; H05K5/03 ; H04M1/02 ; F21V8/00 ; H01Q1/52 ; H01Q1/24

Abstract:
A metal enclosure of a mobile device, a production method for the metal enclosure, and a mobile device are disclosed. The metal enclosure of a mobile device includes a housing, where at least one gap is disposed on the housing, and the at least one gap divides the housing into at least two electrically insulated parts. The metal enclosure further includes an insulation film attached to a surface of the housing. In the foregoing embodiments, the gap is provided on the housing, so that the housing is divided into the at least two electrically insulated parts. Each gap is filled with an insulation object, and the gap on the surface of the housing and the insulation object in the gap form a partition.
Public/Granted literature
- US20190223311A1 Metal Enclosure Of Mobile Device, Production Method For Metal Enclosure, and Mobile Device Public/Granted day:2019-07-18
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