An all-solution electrode fabrication process is provided. The process comprises the steps of: i) preparing and activating a shrinkable polymer substrate for deposition of a a) conductive film; ii) modifying the substrate to incorporate a linker; iii) immobilizing particles of a conductive material on the linkers of the substrate to form a conductive film on the substrate; and vi) heating the modified substrate to a temperature sufficient to cause contraction of the polymer substrate and to result in micro- and/or nano-texturing in the conductive film. The process advantageously yields a novel multi-scale electrode device comprising a polymer substrate; and a textured electro-conductive film linked to the substrate.