Invention Grant
- Patent Title: Multilayered electronic component
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Application No.: US16864653Application Date: 2020-05-01
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Publication No.: US11183333B2Publication Date: 2021-11-23
- Inventor: Won Woo Cho , Jong Duck Kim , Jae Sun Won
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR10-2019-0179349 20191231
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G2/06 ; H01G4/12 ; H01G4/40

Abstract:
A multilayer electronic component includes a body including dielectric layers, and first and second internal electrodes alternately stacked in a first direction, and having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction, a resistor disposed on the second surface, a via electrode exposed to the second surface and connecting the second internal electrode and the resistor to each other, a first external electrode disposed on the third surface and connected to the first internal electrode, and a second external electrode disposed on the fourth surface and connected to the resistor.
Public/Granted literature
- US20210202176A1 MULTILAYERED ELECTRONIC COMPONENT Public/Granted day:2021-07-01
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