Invention Grant
- Patent Title: Interconnect clip with angled contact surface and raised bridge
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Application No.: US16991532Application Date: 2020-08-12
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Publication No.: US11183451B2Publication Date: 2021-11-23
- Inventor: Chai Chee Lee , Wee Boon Tay
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Main IPC: H01L23/522
- IPC: H01L23/522 ; H01L21/56 ; H01L23/31 ; H01L23/528
Abstract:
An interconnect clip includes a die contact portion having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a lead contact portion adjoining the bridge portion and having a lead contact surface or contact point, and a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another. The lower surface of the die contact portion extends along a first plane. The lower surface of the bridge portion extends along a second plane that is completely above the first plane throughout a complete length of the bridge portion. The lead contact surface or contact point is disposed below the first plane.
Public/Granted literature
- US20210074628A1 Interconnect Clip with Angled Contact Surface and Raised Bridge Public/Granted day:2021-03-11
Information query
IPC分类:
