公开(公告)号：US20240087993A1

公开(公告)日：2024-03-14

申请号：US17944657

申请日：2022-09-14

Applicant: Infineon Technologies AG

Inventor： Wee Aun Jason Lim ,  Marie Hazel Barozzo Gabrillo ,  Chai Chee Lee ,  Nor Haqimi Mohamed

IPC: H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/49548 ,  H01L21/4825 ,  H01L21/4842 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/49517 ,  H01L24/32 ,  H01L2224/32245

Abstract: A molded package includes: a semiconductor die; a substrate attached to a bottom side of the semiconductor die; an electrically conductive clip attached to a top side of the semiconductor die; and a mold compound encapsulating the semiconductor die. A top side of the electrically conductive clip faces away from the semiconductor die and has an exposed flat surface that overlays the semiconductor die and is not covered by the mold compound. A bottom side of the electrically conductive clip faces the semiconductor die and has a convex curved surface that is attached to the top side of the semiconductor die. Along a vertical cross-section of the electrically conductive clip from the exposed flat surface to the convex curved surface, the electrically conductive clip has a plano-convex shape delimited by the exposed flat surface and the convex curved surface. A method of producing the molded package is also described.

公开(公告)号：US20210074667A1

公开(公告)日：2021-03-11

申请号：US16561714

申请日：2019-09-05

Applicant: Infineon Technologies AG

Inventor： Chai Chee Lee ,  Wee Boon Tay

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48

Abstract: An interconnect clip includes a die contact portion having planar upper and lower surfaces, a bridge portion adjoining the die contact portion and having planar upper and lower surfaces, a lead contact portion adjoining the bridge portion and having first and second planar lower surfaces that form an angled intersection with one another at a contact point, a first transition surface extending transversely from the lower surface of the bridge portion, and a second transition surface extending transversely from the lower surface of the bridge portion. The lower surface of the die contact portion extends along a first plane. The lower surface of the bridge portion extends from the first transition surface to the second transition surface along a second plane that is completely above the first plane. The first lower surface of the lead contact portion is tilted relative to the first plane.

公开(公告)号：US11183451B2

公开(公告)日：2021-11-23

申请号：US16991532

申请日：2020-08-12

Applicant: Infineon Technologies AG

Inventor： Chai Chee Lee ,  Wee Boon Tay

IPC: H01L23/522 ,  H01L21/56 ,  H01L23/31 ,  H01L23/528

Abstract: An interconnect clip includes a die contact portion having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a lead contact portion adjoining the bridge portion and having a lead contact surface or contact point, and a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another. The lower surface of the die contact portion extends along a first plane. The lower surface of the bridge portion extends along a second plane that is completely above the first plane throughout a complete length of the bridge portion. The lead contact surface or contact point is disposed below the first plane.

公开(公告)号：US20210074628A1

公开(公告)日：2021-03-11

申请号：US16991532

申请日：2020-08-12

Applicant: Infineon Technologies AG

Inventor： Chai Chee Lee ,  Wee Boon Tay

IPC: H01L23/522 ,  H01L23/528 ,  H01L23/31 ,  H01L21/56

Abstract: An interconnect clip includes a die contact portion having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another, a lead contact portion adjoining the bridge portion and having a lead contact surface or contact point, and a bridge portion adjoining the die contact portion and having substantially planar upper and lower surfaces that are parallel to and opposite from one another. The lower surface of the die contact portion extends along a first plane. The lower surface of the bridge portion extends along a second plane that is completely above the first plane throughout a complete length of the bridge portion. The lead contact surface or contact point is disposed below the first plane.