Invention Grant
- Patent Title: Interposer and method for manufacturing interposer
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Application No.: US16719047Application Date: 2019-12-18
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Publication No.: US11183784B2Publication Date: 2021-11-23
- Inventor: Shinichi Hashimoto , Hiroshi Shirai , Masayuki Aizawa
- Applicant: Tyco Electronics Japan G.K.
- Applicant Address: JP Kawasaki
- Assignee: Tyco Electronics Japan G.K.
- Current Assignee: Tyco Electronics Japan G.K.
- Current Assignee Address: JP Kawasaki
- Agency: Barley Snyder
- Priority: JPJP2018-237229 20181219
- Main IPC: H01R12/71
- IPC: H01R12/71 ; H05K1/11 ; H01R13/24

Abstract:
An interposer includes a housing and a contact disposed in the housing. The housing has a first face, a second face opposite the first face, and a passageway penetrating the first face and the second face. The contact has a base portion press-fitted in the passageway, a first contact beam extending obliquely with respect to the first face from the base portion, and a second contact beam extending obliquely with respect to the second face from the base portion. The first contact beam extends outward beyond the first face and has a first contact point portion. The second contact beam extends outward beyond the second face and has a second contact point portion. The first contact point portion and the second contact point portion both extend beyond a penetrated region of the passageway in a direction perpendicular to an insertion direction in which the contact is inserted into the passageway.
Information query